Yangjie Technology signed a strategic cooperation framework agreement to build an integrated circuit device packaging base

Yangjie Technology recently announced that the company has signed the Strategic Cooperation Framework Agreement for Integrated Circuit Device Packaging Bases in Wuxi City, Jiangsu Province, and Yixing Economic and Technological Development Zone and Tianjin Zhonghuan Semiconductor Co., Ltd. (hereinafter referred to as “Central Shares”). It is agreed to jointly invest in the construction of integrated circuit device packaging base in Yixing, Jiangsu.
The main contents of the agreement include: The company and Zhonghuan have established a joint venture company in Yixing. The shareholding ratio is tentatively set as follows: 40% of Zhonghuan shares and 60% of the company. After the establishment of the joint venture company, it is responsible for the construction and operation of the integrated circuit device packaging base. The total investment scale of integrated circuit device packaging base is about 1 billion yuan (in phases). The actual total investment can be adjusted accordingly according to specific needs.
The company said that through the signing of this agreement, all parties will reach a strategic partnership, which will help to fully tap and leverage the core resources and advantages of all parties, and carry out in-depth cooperation in the field of integrated circuit device packaging to achieve complementary advantages and mutual benefit. , in line with the company’s overall strategic layout. If the subsequent specific projects are put into place, it will promote the company’s business development and product extension, and further enhance the company’s sustainable development capability and core competitiveness.