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Tongfu Micro-Electricity: Cross-strait sealing and testing cooperation

Shi Lei, president of Fujitsu Microelectronics, Nantong, China, said that the integration of semiconductor packaging and testing is also due to the consolidation of the client, which is an inevitable trend. The way of cross-strait cooperation is “anything is possibleand joint ventures are also a good direction.
The 2016 International Semiconductor Exhibition continued to debut, and a cross-strait cooperation seminar was held in the afternoon. Shi Lei was invited to give a speech.
Shi Lei pointed out that mainland China has seized the trend of smart phone development and developed its own semiconductor industry.
He quoted data pointing out that in the field of foundry, Taiwan and China have a global market share of 72%, of which Taiwan accounts for 66%. In the field of packaging and testing, the cross-strait market share in the global market reached more than 70%. Mainland China is currently in full bloom in the 12-inch wafer fab.
Shi Lei said that the integration trend of the packaging and testing industry will continue, mainly because the client concentration is getting higher and higher; the consolidation of the testing and testing end is also due to the consolidation of the client, which is an inevitable trend.
Speaking of cooperation with Taiwanese manufacturers, Shi Lei pointed out that Tongfu Microelectronics has long focused on cooperation with Taiwanese companies, including Taiwan’s IC design companies and numerous supply chains.
Shi Lei pointed out that five years ago, Tongfu Microelectronics opened cooperation with MediaTek, and Tongfu Microelectronics was also the first packaging and testing partner selected by MediaTek in mainland China. The cooperation between the two sides is now progressing.
In the advanced production capacity layout, Shi Lei pointed out that Tongfu Microelectronics actively expanded the 12-inch 28-nm process wafer copper pillar bump (Cu Pillar) production line. As of June this year, the cumulative shipments exceeded 40,000.
In the test section, Shi Lei pointed out that Tongfu Microelectronics has a development plan at the test end. Considering the vast territory of China, Tongfu Microelectronics will develop a complete solution in the field of semiconductor packaging and testing.
Shi Lei said that Tongfu Microelectronics will not develop the field of foundry, he pointed out that there are many other things to do, and the field of packaging and testing is promising.
Speaking of the co-opetition relationship between the cross-strait sealing and testing industries, Shi Lei suggested that the two sides can actively cooperate, “first pick out other soft persimmons.”
Shi Lei said that if Taiwan’s semiconductor industry should continue to develop, it should go to mainland China. The two sides of the strait can become the best partners. The purpose of cooperation is also to compete. Even if it is a brother, occasionally it will be a noisy, and the feelings can still be very good.
Shi Lei said that in the field of semiconductor packaging and testing, the way of cooperation between Taiwan and mainland China is “anything can be done”, and the joint venture is also a good direction, and the capacity of each other will not be excessively expanded.

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