Panasonic released a sulfur-free packaging material for semiconductor packages using copper wire bonds on March 3, 2016. By using a sulfur-free process, the life at high temperatures can be extended and reliability can be improved. Mass production will begin in October 2016.
A semiconductor package supporting copper wire bonding used in industrial fields such as ECUs and robots is envisaged. Matsushita said that the product will not only promote the development of copper wire in the field of consumer equipment, but also in the field of consumer products.
In the bonding of the semiconductor chip and the lead frame, copper is currently widely used in addition to gold. This is because copper has high bonding reliability in a high temperature environment and the market price is stable.
The original copper-clad packaging material is often added with sulfur in order to improve the adhesion between the packaging material and the substrate such as the lead frame. However, the sulfur-containing component will vaporize at a high temperature of 175 ° C or higher, corroding the copper wire, resulting in poor connection. Therefore, the semiconductor package used in a high temperature environment is difficult to use copper wire bonding.
Panasonic has developed a resin system modification technology that improves the adhesion between the package material and the lead frame without adding sulfur, and achieves heat resistance at 175 ° C for 3,000 hours without conduction failure. The original product will have poor conduction during 1000 hours at 175 °C.