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Intel pushes new low temperature solder paste soldering process

High-calorie, high-energy, high-carbon dioxide emissions the “three highsproblem that has plagued electronics manufacturing for more than a decade, is finally expected to break. On March 14th, at SEMICON China 2017, the world‘s largest semiconductor industry event, Intel (Booth W5-5523) introduced its new Low Temperature Solder (LTS) welding process to industry partners. This is an innovation. Sexual surface soldering technology can effectively reduce heat, energy consumption and carbon emissions in the manufacturing process of electronic products, and further reduce the production cost of enterprises. This key breakthrough technology will inject new momentum into the development of the manufacturing industry. Under the background of China’s full promotion of industrial upgrading and full implementation of “Made in China 2025”, this process will make environmental protection targets for energy conservation and emission reduction and low-carbon economy. Contribution is a powerful manifestation of innovation-driven development.
As a leader in the semiconductor industry, Intel has always been a model in the field of corporate social responsibility. Intel not only leads the industry in providing green end products, but also leads the industry in product development, manufacturing, and recycling, and promotes greener, greener materials, technologies, processes, and manufacturing processes throughout the industry chain. The new low-temperature solder paste soldering process is another result of Intel’s practice of corporate social responsibility and green development.
The development of the new lowtemperature solder paste soldering process was initiated by Intel and was jointly promoted by the strategic partner Lenovo Group and solder paste manufacturers. The scientific principles and test methods required for development and verification reflect true innovation. Through the adjustment of different alloy welding materials (tin, antimony) and flux adjustment, combined with the combination of reflow soldering temperature and time, thousands of times The trial ultimately led to this industry-leading innovation. The use of bismuth instead of silver and copper as a metal component of solder paste not only reduces production costs, but also saves valuable silver and copper resources.
The new low-temperature solder paste soldering process is the same as the standard electronic assembly technology using surface mount technology (SMT), but with the new low-temperature solder paste soldering process, the maximum soldering temperature of the original part is only about 180 degrees Celsius, which is about 70 degrees lower than the conventional method. The entire test and verification process uses low-temperature solder, using existing reflow soldering equipment to successfully implement new processes while reducing production costs.
Lianbao, the production and research base of Lenovo, undertook the actual verification of the process and found that its carbon emissions were significantly reduced. Lenovo plans to implement a new low-temperature solder paste welding process in eight SMT lines in 2017, which is expected to reduce carbon emissions by 35%. By the end of 2018, Lenovo will have 33 SMT production lines (each with two welding furnaces) using a new process, which is expected to reduce CO2 emissions by 5,956 tons per year, equivalent to the CO2 emissions from 670,170 gallons of gasoline. The new process reduces thermal stress during the “baking” process, further improving equipment reliability. In the early deployment phase, Lenovo found that the printed circuit board has a 50% reduction in warpage during manufacturing and a reduced defect rate per million parts.
The peak temperature of low-temperature solder paste soldering is reduced from 250 ° C to 180 ° C, and the warp curvature of printed circuit boards is reduced by more than 50%.
The new low-temperature solder paste soldering process can be widely applied to all electronic industry manufacturing processes involving printed circuit boards, and product integration has expanded the design freedom and imagination. Intel will work with partners and industry peers to promote the popularization of this technology, help the innovation of the integrated circuit industry, support the implementation of “Made in China 2025”, promote green development, and build an ecological civilization.

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